Kingbo RMA218 100g for BGA Reball Flux with Maximum Solder Joint Adherence
Description
【High-viscosity no-clean flux】Kingbo RMA-218 100g is a high-viscosity no-clean flux designed for rework, fixing balls or pins on for BGA, CGA, and CSP packages, and for flip-chips on PWB substrates. It strong adhesion and reliable solder joints.
【Enhanced for BGA ball adhesion】The good formulation of for BGA ball/ball with Kingbo RMA-218 flux improves the adhesion of solder balls, resulting in more secure and connections.
【 reflow options】This flux can be easily refluxed using hot air, infrared, oven, or nitrogen environment, providing flexibility in different reflow methods to suit your specific needs.
【Bright solder joints】After reflow, the application of 100 grams of Kingbo RMA-218 flux leaves bright and visually appealing solder joints, ensuring and professional results.
【Long viscosity life】Thanks to its high viscosity value, Kingbo RMA-218 flux offers an extended viscosity life, allowing for prolonged usage without sacrificing performance.
